Rigid PCB Capabilities

  • Materials

    • RoHs Compliant FR-4
    • High Temp FR4
    • Halogen Free
    • Metal Based
    • PTFE
    • Rogers
    • Taconic
    • Getek
    • Isola

    Copper

    • Up to 10oz. external
    • Up to 6 oz. internal
    • Layer Count
    • Up to 36 layers from prototypes to mass
    • production
    • Minimum Board Thickness
    • 2 Layer - 0.008
    • 4 Layer - 0.016
    • 6 Layer - 0.020
    • 8 Layer - 0.028

    Maximum Board Thickness

    • Up to 0.400

    Maximum Board Size

    • Double sided - 24" X 35"
    • Multilayer - 22" X 35"

    Minimum Hole Size

    • Mechanical - 0.006
    • Laser - 0.003

    Minimum Line/Space

    • External - 0.004/0.004
    • Internal - 0.003/0.003

    Hole Aspect Ratio

    • Up to 20:1

    Minimum Pad Pitch

    • SMT - 0.008
    • BGA Ball - 0.016
  • Impedance Control

    • TDR - ±10%

    Surface Finish

    • Lead Free Solder
    • Immersion Gold
    • Immersion Tin
    • Immersion Silver
    • O.S.P. (Entek 106HT)
    • Carbon Ink

    Solder Mask

    • Taiyo LPI (Available in several colors)
    • Tamura (Available in several colors)

    Depanelization

    • Routing
    • V-Scoring
    • Punching

    Special Technologies

    • Blind Vias
    • Buried Vias
    • Stacked Micro Vias
    • BGA
    • Via-In-Pad

    Special Process

    • Via hole plugging (Conductive & Non-conductive)
    • Plasma Etch Back
    • Counter Bore
    • Counter Sink

    Certifications

    • UL Approved
    • ISO9001-2000
    • ISO14001
    • TL9000
    • QS9000
    • TS16949
    • OHSAS18001