Flex/Rigid Flex PCB Capabilities

    • Up to 12 layers Flex
    • Up to 12 layers Rigid-Flex
    • Adhesiveless base
    • Thin-core FR4
    • Shielding:
      Copper, Silver ink
    • Flex with rigidizer:
      P.I., FR4, Metal
    • Flex with dimples
    • Pre-formed Flex
    • Flex with Impedance control
    • Line-width/Spacing:
      3 mil/3mil
    • Layer to Layer:
      ± 5mil
    • Minimum hole size:
      0.008"
    • Copper thickness:
      1/4 oz min
    • Panel Size:
      18" × 24"
    • Cover:
      P.I., P.I.C., Flexible Solder Mask
    • Adhesiveless material
    • Stiffener material:
      FR4, metal
    • Finishing:
      Hard/Soft/Immersion Gold,
    • Tin/Lead
    • Outline to outline dimension:
      ± 3mil
    • Punched hole to outline dimension:
      ± 3mil
    • Drilled hole to outline dimension:
      ± 8mil
    • Impedance control:
      ±10mil
    • QS9002, ISO9002, UL